During AMD’s presentation at Computex 2021, the company’s next big news in “high performance computing” was revealed – 3D circuit stacking. Instead of building on width, AMD has instead started stacking on height, which means in the first application, among other things, that the right amount of cache can be messed up.
► Read all articles from #Computex 2021
AMD calls 3D Vertical Cache Technology (3D V-Cache) and at the presentation showed a prototype based on the Ryzen 5000 series with two CCDsChiplets It has eight Zen 3 cores each. The company also revealed that processors with 3D V-Cache will begin manufacturing at the end of the year, indicating that Update Just in time for an interview with “Alder Lake” from Intel. Now more details emerge confirming that this is the case.
in conversation with Tom’s Hardware confirms AMD That Zen 3 processors with 3D V-Cache have been put into production by the end of 2021, which, like the prototype shown, is a stacked layer of L3 cache. Update Of the products in the Ryzen 5000 series or a completely new series do not appear, but Lisa Su is clear that the technology is targeting high endPiece.